Polysynthetic silver thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.

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Product Review

Polysynthetic silver thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.

  • Weight: 1.0g/tube
  • Operation Temperature: -50/180°c
  • Thermal Conductivity: >3.17W/m.k
  • Thermal Resistance: <0.067°c-in2/w
  • 20% metal oxide compounds

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