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Product Review
- Electronic Potting and Encapsulating Compound For Printed Circuit Board -Insulate AC/DC High And Low Voltage
- Bonds to ABS PVC Plastic Housing, Wire Jackets, Mold Injected Components, Powder Coated And Metal Substrates
- None Electrically Conductive Epoxy Resin For Waterproofing And Embedding Electronic Components
- Opaque Black For Permanent Masking, Room Temperature Curing, 2:1 Mix Ratio, Medium Setting
- Low Viscosity, Self Leveling, Medium Set Time, Cures Very Rigid, Up To 190°F (90°C) Operating Temperature
