Product Review
Included Parts:
- Large Straight-Fin Anodized Heatsink with 3M adhesive for SoC
- Small Straight-Fin Anodized Heatsink with 3M adhesive for LAN Chipset
Supported Boards:
- Raspberry Pi 4 Model B
- Raspberry Pi 3 Model B+
- Raspberry Pi 3 Model B
- Raspberry Pi 2 Model B
Additional Boards supported by Large Heatsink:
- Libre Computer Board ALL-H3-CC
- Libre Computer Board AML-S905X-CC
- Libre Computer Board ROC-RK3328-CC
- Banana Pi M3 (Allwinner A83T)
- Orange Pi Boards with Allwinner H2+/H3/H5
- EXTREME PERFORMANCE: Straight-fin design with twice the height of other heatsinks for extra heat dissipation performance whether actively or passively cooled. Mandatory for applications in high temperature, sealed, or overclocked applications.
- LONG LASTING EXACT FIT: CPU and LAN chipset heatsinks are fabricated specifically for the Raspberry Pi 4 Model B. Double-sided thermal transfer tape offers high thermal conductivity and long lasting adhesion in all mounting scenarios.
- QUICK AND SIMPLE INSTALLATION: Peel and stick in the orientation with the most airflow. Most effective solution for reliable performance and longevity. No more messy thermal paste and compatible with LoveRPi Power over Ethernet HAT v2 for Raspberry Pi 4.
- MAXIMUM FREQUENCY FOR LONGER: Maintain 1.5GHz for more than a minute before throttling kicks in. That is 5x longer than without a heatsink. Decrease idle temperatures by 20°F for longer component life and more reliable operation.
- MUST HAVE FOR RASPBERRY PI 4: The SoC and USB 3.0 bridge require heatsinks since they exceed 50°C. Other components like LPDDR4 and gigabit PHY are best passively cooled since they are near components with higher z-height that may short circuit. Please attach the heatsinks as pictured to avoid accidental damage to the Raspberry Pi 4 Model B board.
