1pc Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Transistor Semiconductor Devices with 16 pcs fins 3.93"(L) x 3.93"(W) x 0.7"(H) /100mm(L) x 100mm(W) x 18mm(H)

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* 100% New Heatsink plaster.
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink，VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200 ℃ / 24Hours)
* Evaporation: 0.001% (200 ℃ / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25 ℃)
* Strength of connected buildings: 25Kg
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200 ℃
* Net Weight: 10g

Do not use thermal glue between CPU Chip and heatsink

Package Includes:
1 x Thermal Heatsink Plaster Glue.

Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.
Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
It has good thermal conductivity and wide service temperature range(-60~280 degrees Celsius)
Thermal conductivity:> 1.5W/m-K, Do not use thermal glue "between CPU and HEATSINK"!
Package Includes : 1 x GENNEL G109 10g thermal glue

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GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance

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