Product Review

Key Features Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Intel® C622 Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 M.2 Interface: PCIe 3.0 x4 M.2 Form Factor: 2260, 2280, 22110, 2 PCI-E 3.0 NVMExpress x4 Internal Port(s) 1 VGA port(s) Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Dual LAN with 10GBase-T with Intel® X557