Copper 1100 Vapor Chamber and Stacked Fin passive heatsink for 1U server solution up to TDP 180 Watts heat dissipation.

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Product Review

Copper 1100 Vapor Chamber and Stacked Fin passive heatsink for 1U server solution up to TDP 180 Watts heat dissipation.

  • CPU Support : AMD EPYC
  • CPU Socket : SP3
  • Solution : 1U Server and Up
  • Material : Copper 1100 with Skiving Fin
  • Dimensions : 120 x 82 x 27 mm